> Adopts high-quality 3D NAND wafer level chip
> Supports PCIe3.0 x4, and NVMe 1.3 protocol
> All-metal cooling plate is included equipped with intelligent temperature control technology
> Supports TRIM to improve read/write performance and speed
> Supports Max. Write technology for full-disk SLC cache
> Supports LDPC ECC
> Low power consumption management
